Industry* |
|
Application* |
|
Sputtering Source* |
Sputtering Cathode : Quantity
|
E-beam Source* |
Pocket Size : cc /
Pocket : Quantity
|
Thermal Source* |
Quantity
|
Plasma Source* |
|
Substrate Size* |
|
Substrate Quantity* |
|
Substrate Material* |
|
Substrate Type* |
|
Substrate Pre-clean* |
|
Substrate Load Lock* |
|
Glove Box Interface* |
|
Film Thickness Monitor* |
Film Thickness Controller
|
Pumping* |
Low Vacuum Pump :
|
High Vacuum Pump :
|
System Base Pressure :
|
Process Pressure :
|
Process Gas* |
|
Pressure Control* |
|
Power Supply* |
|
Performance Requirments* |
Rate :
Uniformity :
Throughput :
|
Process Control* |
|
Comments* |
|